YYP 82 Internal Bond Strenth Tester

Short Description:

Interlayer bond strength refers to the board’s ability to resist interlayer separation and is a reflection of the paper’s internal bond ability, which is very important for processing multilayer paper and cardboard.

Low or unevenly distributed internal bonding values may cause problems for paper and cardboard when tiling in offset printing presses using adhesive inks;

High bonding strength will bring difficulty to processing and increase production cost.

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Product Detail

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Technical Parameters:

Supply voltage	AC(100～240)V，(50/60)Hz 50W
Working environment	Temperature (10 ~ 35)℃, relative humidity ≤ 85%
Air source	≥0.4Mpa
Display screen	7 inch touch screen
Sample size	25.4mm*25.4mm
Specimen holding force	0 ~ 60kg/cm²(adjustable)
Impact Angle	90°
resolution	0.1J/m²
Measuring range	Grade A: (20 ~ 500) J/ m² ;Grade B: (500 ~ 1000) J/ m²
Indication error	Grade A: ±1J/ m² Grade B: ±2J/ m²
Unit	J/m²
Data storage	Can store 16,000 batches of data; Maximum 20 test data per batch
Communication interface	RS232
Printer	Thermal printer
Dimension	460×310×515 mm
Net weight	25kg